SKU: 28947928713
Ships within 48 hours · Estimated delivery Sep 3 - Sep 8
ultra-precision cutting
Original Goot Wick Soldering Wick Accessory Braided Copper Wire Desoldering Wick BGA Solder Remover CP1515 CP2015 CP2515 CP3515
Sensor:16MP COMS
5 Convex Cross/Phillips 1
MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items ultra-precision cuttingMECHANIC Heat Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one click heating, adjustable from 160C to 250C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal. Features: 1. Employs a professional temperature control curve algorithm with a built in factory calibrated
US$ 150.00
US$ 16.99
US$ 35.00
US$ 54.00
