SKU: 18558215177
Ships within 48 hours · Estimated delivery Sep 5 - Sep 10
60 W heating power
Marking/engraving/removing the back cover
can replace the screen of a variety of models
Air volume is adjustable from 5% to 100%
JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform JBC 60 W heating powerJTXTOOLS T4MAX Glue Removal & Reballing Platform with 17 precision stencils for efficient glue removal and precise tin planting on CPU, EMMC, and RAM chips. Supporting 102 chip models across Apple iPhone, Android, Exynos, Qualcomm, HiSilicon, and Dimensity processors. A powerful magnetic force firmly secures the chip, automatically clamping and aligning it for precise chip placement. It is an essential tool for mobile phone repair technicians
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